METHOD FOR PRODUCING CONNECTED STRUCTURE AND CONNECTION FILM

WIPO Patent Application WO/2020/050188

A1

The present invention provides: a novel and improved method for producing a connected structure, said method enabling provisional bonding without the application of heat; and a connection film. The above are achieved by means of a method for producing a connected structure according to one aspect of the present invention, which connects a first component and a second component with use of a connection film, and which comprises: a step wherein a release film is provided on one surface of the connection film, and the connection film is mounted on the first component in such a manner that the other surface of the connection film is in contact with the first component; a step wherein the connection film is provisionally bonded to the first component by irradiating the connection film with light; a step wherein the release film is removed from the connection film; a step wherein the second component is mounted on the connection film; and a step wherein the first component and the second component are permanently pressure-bonded to each other by applying a pressure to the second component, while heating the connection film.

INASE KEISUKE (JP)

PCT/JP2019/034314

March 12, 2020

August 31, 2019

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DEXERIALS CORP (JP)

C09J5/06; C09J4/00; C09J7/35; C09J9/02; C09J201/00; H01L21/60; H05K3/32

WO2017104417A1	2017-06-22
WO2015083809A1	2015-06-11
WO2018180685A1	2018-10-04

JP2013014755A	2013-01-24
JPH11191320A	1999-07-13
JP2003064324A	2003-03-05
JP2016042541A	2016-03-31

NOGUCHI, Nobuhiro (JP)

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