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Patent Searching and Data


Title:
METHOD FOR PRODUCING CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/162782
Kind Code:
A1
Abstract:
A method for producing a curable resin composition, the method comprising a step for storing a starting material composition at a temperature of 40°C to 150°C inclusive under a hermetically closed state, in which the starting material composition comprises a polysilsesquioxane polymer (A) having a reactive silyl group and a hydrocarbon group that is directly bound to a silicon atom in a polysilsesquioxane backbone, a poly(alkylene oxide) polymer (B) having a reactive silyl group and having no polysilsesquioxane backbone, and a curing catalyst (C) comprising a tetravalent tin catalyst and/or a strongly basic catalyst.

Inventors:
SAITO TAKAHIRO
Application Number:
PCT/JP2023/005020
Publication Date:
August 31, 2023
Filing Date:
February 14, 2023
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08J3/00; C08G65/336; C08G77/46; C08K5/29; C08K5/57; C08L71/02; C08L83/06; C08L83/10
Foreign References:
JP2018076420A2018-05-17
JP2001506283A2001-05-15
JP2011215205A2011-10-27
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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