METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2022/070730

A1

The present invention provides: a method for producing a cured product, said method enabling the achievement of a cured product that exhibits excellent elongation at break and excellent chemical resistance even if cured at a low temperature; a method for producing a multilayer body, said method comprising the above-described method for producing a cured product; and a method for producing a semiconductor device, said method comprising the above-described method for producing a cured product or the above-described method for producing a multilayer body.　This method for producing a cured product comprises: a film formation step wherein a film is formed by applying a specific photosensitive resin composition onto a base material; a light exposure step wherein the film is selectively exposed to light; a development step wherein a pattern is formed by developing the film after the light exposure by means of a developer liquid; a treatment step wherein a treatment liquid and the pattern are brought into contact with each other; and a heating step wherein the pattern after the treatment step is heated. At least one of the developer liquid and the treatment liquid contains at least one compound that is selected from the group consisting of bases and base generators.

JP5193565	A photocurable resin composition, a cured product pattern thereof, and a printed wiring board provided with the cured product pattern.
WO/2023/228568	PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM
JP3877581	RESIN COMPOSITION FOR POLYMER SOLID ELECTROLYTE, POLYMER SOLID ELECTROLYTE AND POLYMER BATTERY

TAKASHIMA MISAKI (JP)
SHIMADA KAZUTO (JP)
NOZAKI ATSUYASU (JP)
SATO NAOKI (JP)

PCT/JP2021/031879

April 07, 2022

August 31, 2021

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FUJIFILM CORP (JP)

C08F290/14; C08G73/10; C08G73/12; G03F7/027; G03F7/037; G03F7/20; G03F7/32; G03F7/40; H01L21/027; H05K3/28

JPH0683049A	1994-03-25
JPH03194559A	1991-08-26
JPH01221741A	1989-09-05
JP2014157310A	2014-08-28

NAKASHIMA Junko et al. (JP)

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