Title:
METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/008090
Kind Code:
A1
Abstract:
The present invention provides: a method for producing a cured product, the method enabling the achievement of a cured product that generates little outgas; a method for producing a multilayer body, the method using the method for producing a cured product; a method for producing a semiconductor device; a resin composition which enables the achievement of a cured product that generates little outgas; a cured product which is obtained by curing this resin composition; a multilayer body which comprises this cured product; and a semiconductor device. This method for producing a cured product comprises a film formation step in which a film is formed by applying a resin composition that contains a precursor of a cyclized resin onto a base material, and a heating step in which the film is heated at a heating temperature of 180°C or less; and the thus-obtained cured product has a glass transition temperature of 200°C or more.
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Inventors:
NOZAKI ATSUYASU (JP)
TAKASHIMA MISAKI (JP)
TAKASHIMA MISAKI (JP)
Application Number:
PCT/JP2022/026314
Publication Date:
February 02, 2023
Filing Date:
June 30, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08G73/10; G03F7/027; G03F7/028; G03F7/037; G03F7/20; G03F7/32
Domestic Patent References:
| WO2018025738A1 | 2018-02-08 |
Foreign References:
| JP2016199662A | 2016-12-01 | |||
| JP2016027357A | 2016-02-18 | |||
| JP2017215565A | 2017-12-07 |
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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