Title:
METHOD FOR PRODUCING ELECTROFORMED SPRING, AND ELECTROFORMED SPRING
Document Type and Number:
WIPO Patent Application WO/2024/106128
Kind Code:
A1
Abstract:
The present invention provides a novel method for producing an electroformed spring and the electroformed spring. This method for producing an electroformed spring comprises a step in which an electroformed layer is formed on a core having an electroconductive surface, a step in which a metal layer is formed on the electroformed layer, a step in which the metal layer is spirally irradiated with laser light to remove some of the metal layer and spirally expose the electroformed layer, a step in which the spirally exposed electroformed layer is removed to obtain a spring-shaped electroformed layer on the core, and a step in which the core including the spring-shaped electroformed layer is separated from the core to obtain the electroformed spring.
Inventors:
FUKUMOTO KOHEI (JP)
SASAKI SHINGO (JP)
SASAKI SHINGO (JP)
Application Number:
PCT/JP2023/037898
Publication Date:
May 23, 2024
Filing Date:
October 19, 2023
Export Citation:
Assignee:
YOKOWO SEISAKUSHO KK (JP)
International Classes:
C25D1/02; B23K26/364; B81B3/00; B81C99/00; C25D1/00; F16F1/02; G01R1/067
Domestic Patent References:
| WO2019208216A1 | 2019-10-31 | |||
| WO2012176289A1 | 2012-12-27 |
Foreign References:
| JP2018200194A | 2018-12-20 | |||
| JP2008062585A | 2008-03-21 | |||
| JP2004091878A | 2004-03-25 | |||
| CN102555659A | 2012-07-11 |
Attorney, Agent or Firm:
PROWIN PATENT & TRADEMARK ATTORNEYS' OFFICE (JP)
Download PDF: