Title:
METHOD OF PRODUCING ELECTRONIC COMPONENT MOUNTING STRUCTURE, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2010/143379
Kind Code:
A1
Abstract:
Disclosed is a method of producing an electronic component mounting structure, provided with a mounting step of mounting an electronic component on a circuit board by soldering terminals connected to the electronic component to electrodes formed on a circuit board surface, a coating step of coating a liquid state curable resin composition so as to cover the soldered section on the surface of the circuit board surface formed by soldering, said liquid state curable resin composition including a curable resin and a foaming agent, a curing step of forming a cured resin by curing the liquid state curable resin composition at a temperature lower than the temperature at which the foaming agent foams, and a foaming step which causes a foaming agent to foam by heating at least a portion of the cured resin.
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Inventors:
KOWADA HIROE
YAMAGUCHI ATSUSHI
MATSUNO KOSO
TSUJIMURA HIDEYUKI
YAMAGUCHI ATSUSHI
MATSUNO KOSO
TSUJIMURA HIDEYUKI
Application Number:
PCT/JP2010/003707
Publication Date:
December 16, 2010
Filing Date:
June 03, 2010
Export Citation:
Assignee:
PANASONIC CORP (JP)
KOWADA HIROE
YAMAGUCHI ATSUSHI
MATSUNO KOSO
TSUJIMURA HIDEYUKI
KOWADA HIROE
YAMAGUCHI ATSUSHI
MATSUNO KOSO
TSUJIMURA HIDEYUKI
International Classes:
H01L21/56; H01L21/60; H01L25/04; H01L25/18; H05K3/28
Foreign References:
| JPH0487680U | 1992-07-30 | |||
| JPH04192397A | 1992-07-10 | |||
| JP2001060756A | 2001-03-06 | |||
| JPH09315059A | 1997-12-09 |
Attorney, Agent or Firm:
ISHII, Kazuo et al. (JP)
Kazuo Ishii (JP)
Kazuo Ishii (JP)
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