Title:
METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/251420
Kind Code:
A1
Abstract:
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A) and an adhesive film (50) that is bonded to the circuit formation surface (30A) of the electronic component (30); a step (B) for back grinding a surface of the electronic component (30), said surface being on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with ultraviolet light. With respect to this method for producing an electronic device, the adhesive film (50) comprises a base material layer (10) and an ultraviolet curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the elongation at break of the adhesive resin layer (20) after being irradiated with ultraviolet light with the ultraviolet dose of 1,080 mJ/cm2 is from 20% to 200%.
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Inventors:
YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2021/021865
Publication Date:
December 16, 2021
Filing Date:
June 09, 2021
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
C09J11/06; B23K26/53; C09J7/10; C09J7/38; C09J133/00; H01L21/301; H01L21/304
Domestic Patent References:
| WO2018021145A1 | 2018-02-01 | |||
| WO2019181731A1 | 2019-09-26 | |||
| WO2017061132A1 | 2017-04-13 | |||
| WO2009110426A1 | 2009-09-11 |
Foreign References:
| JP2009138183A | 2009-06-25 | |||
| JP2009035635A | 2009-02-19 | |||
| JP2002053819A | 2002-02-19 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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