Title:
METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/250131
Kind Code:
A1
Abstract:
This method for producing an electronic device includes at least a step (A) of preparing a structure that is provided with a wafer having a circuit-forming surface and an adhesive film affixed on the circuit-forming surface side of the wafer, a step (B) of backgrinding a surface of the wafer on the opposite side from the circuit-forming surface, and a step (C) of irradiating the adhesive film with UV light and then removing the adhesive film from the wafer, wherein the adhesive film is provided with a base material layer and an adhesive resin layer that is provided on one surface side of the base material layer and is constituted by a UV-curable adhesive resin material, and the UV-curable adhesive resin material, when the viscoelastic properties thereof are measured according to the below procedures (i) and (ii), has a storage modulus E' (100°C) at 100°C of 1.0×106 to 3.5×107Pa, and E'(100℃)/E'(-15°C) equals 2.0×10-3 to 1.5×10-2. [Procedures] (i) A film having a film thickness of 0.2 mm is formed using the UV-curable adhesive resin material, and the film is irradiated and UV-cured in a 25°C environment, by using a high-pressure mercury lamp to irradiate UV light having a dominant wavelength of 365 nm at an irradiation intensity of 100 W/cm2 and a UV dose of 1080 mJ/cm2, whereby a cured film is obtained. (ii) The dynamic viscoelasticity of the cured film is measured in a temperature range of -50 to 200°C at a frequency of 1 Hz in a tensile mode.
Inventors:
YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2022/021684
Publication Date:
December 01, 2022
Filing Date:
May 27, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
H01L21/301; C09J7/38
Domestic Patent References:
| WO2020246207A1 | 2020-12-10 |
Foreign References:
| JP2019016633A | 2019-01-31 | |||
| JP2018195746A | 2018-12-06 | |||
| JP2021005623A | 2021-01-14 | |||
| JP2014075560A | 2014-04-24 | |||
| JP2016072546A | 2016-05-09 | |||
| JP2021090297A | 2021-06-10 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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