METHOD FOR PRODUCING FILM CONTAINING CONDUCTIVE STRUCTURE WITH BASE MATERIAL FILM

Title:

METHOD FOR PRODUCING FILM CONTAINING CONDUCTIVE STRUCTURE WITH BASE MATERIAL FILM

Document Type and Number:

WIPO Patent Application WO/2019/009409

Kind Code:

A1

Abstract:

The present invention relates to a method for producing a film containing a conductive structure with a base material film, which comprises: a step (1) for forming a resin layer (X) by applying a thermoplastic resin composition (A) to one surface of a base material film, said thermoplastic resin composition (A) containing at least one thermoplastic resin selected from the group consisting of polyvinyl acetal resins, ionomer resins and ethylene-vinyl acetate copolymer resins; and a step (2) for forming a conductive structure on the resin layer (X).

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Inventors:

ISOUE KOICHIRO (JP)
YASUDA HIROTAKA (JP)

Application Number:

PCT/JP2018/025684

Publication Date:

January 10, 2019

Filing Date:

July 06, 2018

Export Citation:

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Assignee:

KURARAY CO (JP)

International Classes:

C03C27/12; B32B3/14; B32B15/08; B32B17/10; B32B27/06; B32B27/22; H01B13/00; H05B3/20; H05B3/84

Domestic Patent References:

WO2016080406A1

2016-05-26

Foreign References:

JP2016539905A	2016-12-22
JP2015513487A	2015-05-14
JP2016539905A	2016-12-22
JP2000119047A	2000-04-25
EP1235683B1	2003-08-20

Other References: