Title:
METHOD FOR PRODUCING FLEXIBLE PRINTED BOARDS
Document Type and Number:
WIPO Patent Application WO/2022/202082
Kind Code:
A1
Abstract:
This method for producing flexible printed boards comprises a step for coating, using a vertical lift roll coater, a liquid photosensitive resin composition (17) on both sides of a board (11) that has a film-shaped support (13) and wiring (14) disposed on both sides of the film-shaped support (13). A hole (15) is provided in the board (11). The liquid photosensitive resin composition (17) comprises a binder polymer, a photoradical polymerization initiator, a multifunctional epoxy compound, an epoxy cure accelerator, and a radically polymerizable compound having at least three radically polymerizable groups in each molecule. During the coating of the liquid photosensitive resin composition (17), the liquid photosensitive resin composition (17) is coated simultaneously on both sides of the board (11).
Inventors:
SEKITO YOSHIHIDE (JP)
HORIE KEITA (JP)
HORIE KEITA (JP)
Application Number:
PCT/JP2022/007680
Publication Date:
September 29, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B05D1/28; B05D3/00; B05D7/24; G03F7/004; G03F7/027; G03F7/035; G03F7/037; G03F7/16; H05K3/28
Foreign References:
| JP2000156556A | 2000-06-06 | |||
| JP2005173577A | 2005-06-30 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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