Title:
METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/254997
Kind Code:
A1
Abstract:
This method for producing a flexible printed wiring board comprises: a step in which a photomask 50 is arranged so that a light-transmitting section 53 faces a first area R1 and a photoresist layer 40 is exposed via the light-transmitting section 53; and a step in which the photomask 50 is arranged so that the light-transmitting section 53 faces a second area R2 and the photoresist layer 40 is exposed via the light-transmitting section 53. The light-transmitting section 53 has a linear shape including first and second tip sections 55, 56 with a tapered shape, the first tip section 55 includes a first end section 55a and first and second sides 55b, 55c with a curved shape, the second tip section 56 includes a second end section 56a and third and fourth sides 56b, 56c with a curved shape, and the light-transmitting section 53 satisfies formula (1).
Inventors:
ARAI DAISUKE (JP)
IWAMURA TOSHIYA (JP)
IWAMURA TOSHIYA (JP)
Application Number:
PCT/JP2022/018563
Publication Date:
December 08, 2022
Filing Date:
April 22, 2022
Export Citation:
Assignee:
FUJIKURA PRINTED CIRCUITS LTD (JP)
International Classes:
G03F1/70; G03F7/20; H05K1/02; H05K3/06
Domestic Patent References:
| WO2003042759A2 | 2003-05-22 |
Foreign References:
| JP2018092966A | 2018-06-14 | |||
| JP2011044465A | 2011-03-03 | |||
| JP2001308004A | 2001-11-02 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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