Title:
METHOD FOR PRODUCING GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/255625
Kind Code:
A1
Abstract:
Provided is a method for producing a glass substrate capable of reducing dimensional changes during heat treatment while avoiding shortening the life of equipment. A method for producing a glass substrate having a strain point of 690-750°C by melting and molding a glass raw material, wherein the method is characterized in that a glass substrate having a heat shrinkage rate of 15 ppm or less when heat treated for one hour at 500°C is obtained by setting the average cooling rate in the temperature range from the (annealing point+150°C) to the (annealing point-200°C) at 100-400°C/minute in the cooling process during molding.
Inventors:
HAYASHI MASAHIRO (JP)
FUJII MAYU (JP)
FUJII MAYU (JP)
Application Number:
PCT/JP2020/020374
Publication Date:
December 24, 2020
Filing Date:
May 22, 2020
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
C03B25/12; C03B17/06; C03C3/083; C03C3/085; C03C3/087; C03C3/091; C03C3/093; C03C3/097
Domestic Patent References:
WO2018232153A2 | 2018-12-20 | |||
WO2019124271A1 | 2019-06-27 |
Foreign References:
JP2016183091A | 2016-10-20 | |||
JP2014070000A | 2014-04-21 | |||
JP2013230963A | 2013-11-14 | |||
JP2016011235A | 2016-01-21 | |||
JP2013133246A | 2013-07-08 | |||
JP2011020864A | 2011-02-03 |
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