Title:
METHOD FOR PRODUCING HOLLOW PACKAGE AND METHOD FOR PROVIDING PHOTOSENSITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/107840
Kind Code:
A1
Abstract:
This method for producing a hollow package includes: a step for forming a side wall on a substrate having aluminum wiring; and a step for forming a top plate portion on the side wall to produce a hollow structure that houses the aluminum wiring. A photosensitive composition that forms the side wall and/or the top plate portion contains an anion represented by general formula (I1-an). (In general formula (I1-an), A is a heteroatom; X is a halogen atom; R is a monovalent organic group; k is an integer between 1 and 6; m is 0 to 5; n is an integer between 1 and 3; and the value of m/(k+m) is not less than 0 and less than 0.7.)
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Inventors:
YAMAGATA KENICHI (JP)
KONDO TAKAHIRO (JP)
TAKEUCHI HIROAKI (JP)
IMAI HIROFUMI (JP)
KONDO TAKAHIRO (JP)
TAKEUCHI HIROAKI (JP)
IMAI HIROFUMI (JP)
Application Number:
PCT/JP2021/042389
Publication Date:
May 27, 2022
Filing Date:
November 18, 2021
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C07F5/02; C07F9/52; G03F7/004; G03F7/038; H01L23/08; H03H3/08; H03H9/25
Domestic Patent References:
WO2013018635A1 | 2013-02-07 | |||
WO2018194154A1 | 2018-10-25 |
Foreign References:
JP2018013807A | 2018-01-25 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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