Title:
METHOD FOR PRODUCING HOLLOW SILICA PARTICLES
Document Type and Number:
WIPO Patent Application WO/2023/140378
Kind Code:
A1
Abstract:
Provided is a method for producing hollow silica particles which have an average particle diameter of 0.5 μm to 3.0 μm, and in which the total content of alkali metals and alkaline earth metals with respect to the content of the silica in the particles is 50 mass ppm or less, wherein: the hollow silica particles have a relative permittivity of 2.5 or less at a measurement frequency of 5.8 GHz, and have a dielectric dissipation factor of 0.0050 or less. The method comprises the following steps. Step A: A step for using a cationic surfactant A to make an aqueous emulsion of hydrophobic liquid. Step B: A step for adding, to the aqueous emulsion obtained in step A, a silanol precursor, an alkaline substance, and a cationic surfactant B, and generating a hollow silica particle precursor. Step C: A step for heat-treating the hollow silica particle precursor obtained in step B at over 1,000°C but no more than 1,200°C for one hour or more.
Inventors:
HOSHIDA HIROKI (JP)
HAMADA FUMIYA (JP)
HAMADA FUMIYA (JP)
Application Number:
PCT/JP2023/001898
Publication Date:
July 27, 2023
Filing Date:
January 23, 2023
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
C01B33/18; C08K3/36; C08K7/26; C08L101/00
Domestic Patent References:
| WO2021172294A1 | 2021-09-02 |
Foreign References:
| JP2021070592A | 2021-05-06 | |||
| JP2014055084A | 2014-03-27 | |||
| JP2014055082A | 2014-03-27 | |||
| JP2014055083A | 2014-03-27 | |||
| CN111232993A | 2020-06-05 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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