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Title:
METHOD FOR PRODUCING JOINED STRUCTURE, AND JOINED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/133079
Kind Code:
A1
Abstract:
Provided are: a method for producing a joined structure obtained by joining a first member, and a second member comprising resin; and the joined structure obtained by joining the first member and the second member. The method for producing the joined structure includes: a boring step in which a first-member surface section forming the surface to be joined to the second member is irradiated with a laser to form a plurality of bore holes, such that the surface area of first bore holes per unit volume in a region corresponding to a stress concentration section is greater than the surface area of second bore holes per unit volume in a region excluding the aforementioned region; and a joining step in which the first member and the second member are joined by filling the plurality of bore holes with the second member. The joined structure is obtained by: irradiating, with a laser, the first-member surface section to form the plurality of bore holes, such that the surface area of the bore holes per unit volume in the stress concentration section is greater than the surface area of the bore holes per unit volume in a section excluding the stress concentration section; and filling the plurality of bore holes with the second member.

Inventors:
NISHIKAWA KAZUYOSHI (JP)
Application Number:
PCT/JP2016/054420
Publication Date:
August 25, 2016
Filing Date:
February 16, 2016
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B29C65/16; B23K20/02; B23K26/0622; B23K26/386; B23K26/60; B29C45/14; B29C65/20
Foreign References:
JP2010274279A2010-12-09
JP2014166693A2014-09-11
JP2011143539A2011-07-28
JP2008249090A2008-10-16
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
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