Title:
METHOD FOR PRODUCING MOLDING DIE, WAFER LENS, AND OPTICAL LENS
Document Type and Number:
WIPO Patent Application WO/2012/102249
Kind Code:
A1
Abstract:
A first resin material (41b) is filled between one recess (42c) among a plurality of recesses (42c) formed on a sub-master substrate (42) and a first molding face (31) of a master die (30), and thus, while ensuring the thickness of the first resin material (41b) opposing to the first molding face (31), the thickness of a sub-sub-master resin layer (51) formed on the entirety of the sub-master substrate (42) can be made relatively thin. Thereby, while easily increasing the positioning accuracy of the master die (30), the warpage of the sub-master substrate (42) by the sub-sub-master resin layer (51) can be prevented. By providing an annular step (32) around the first molding face (31), a residual film portion (44) defined by the outer edge portion of the sub-sub-master resin layer (51) can be formed between the step (32) and a portion around the recess (42c). Due to the residual film portion (44), the sub-sub-master resin layer (51) can be prevented from being locally thick, and as a result, the thickness of the obtained wafer lens (10) can be thin.
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Inventors:
FUJIMOTO AKIHIRO (JP)
Application Number:
PCT/JP2012/051375
Publication Date:
August 02, 2012
Filing Date:
January 23, 2012
Export Citation:
Assignee:
KONICA MINOLTA OPTO INC (JP)
FUJIMOTO AKIHIRO (JP)
FUJIMOTO AKIHIRO (JP)
International Classes:
B29C33/38; B29C39/10; B29L11/00
Domestic Patent References:
| WO2010143466A1 | 2010-12-16 | |||
| WO2010137368A1 | 2010-12-02 |
Foreign References:
| JP2010102312A | 2010-05-06 | |||
| JP2006245072A | 2006-09-14 | |||
| JP2010251601A | 2010-11-04 |
Attorney, Agent or Firm:
FUKUDA, MITSUHIRO (JP)
Mitsuhiro Fukuda (JP)
Mitsuhiro Fukuda (JP)
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Claims: