METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD

WIPO Patent Application WO/2021/095865

A1

The present disclosure addresses the problem of providing a method for producing a multilayer printed wiring board, by which the high-frequency characteristics of a multilayer printed wiring board provided with an insulating layer containing polyimide are easy to improve. This method includes a step for preparing a first laminated board (21) and a second laminated board (22). The first laminated board (21) is provided with a first conductor layer (41), a first insulating layer (31) containing polyimide, and a second conductor layer (42). The second laminated board (22) is provided with a second insulating layer (32) containing polyimide, and a third conductor layer (43). This method further includes: a heating step for heating each of the first laminated board (21) and the second laminated board (22) under the conditions of a heating temperature of at least 100°C and a heating time of at least 0.5 hours; and after the heating step, a laminating step for superimposing the first laminated board (21) and the second laminated board (22) by interposing a third insulating layer (33) between the second conductor layer (42) and the second insulating layer (32).

KAWAHARA TOMOYUKI
KOMORI KIYOTAKA
KOYAMA MASAYA

PCT/JP2020/042485

May 20, 2021

November 13, 2020

Click for automatic bibliography generation  

PANASONIC IP MAN CO LTD (JP)

B32B27/34; B32B15/088; H05K1/02; H05K3/46

WO2007116685A1

2007-10-18

JP2000052483A	2000-02-22
JP2015199328A	2015-11-12

HOKUTO PATENT ATTORNEYS OFFICE (JP)

View/Download PDF      PDF Help

Previous Patent: METHOD FOR PRODUCING SEMICONDUCTOR-TYPE SINGLE-WALLED CARBON NANOTUBE DISPERSION

Next Patent: METHOD FOR PRODUCING SEQUENCING LIBRARY