Title:
METHOD FOR PRODUCING MULTILAYER WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2012/033152
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for producing a multilayer wiring substrate with excellent producibility that can produce metal wiring with a high degree of fineness and superior adherence and can produce a multilayer wiring substrate with superior contact reliability for via holes. This method for producing a multilayer wiring substrate comprises: a step (A) for forming an insulating layer on the surface of a wiring substrate provided with metal wiring; a step (B) for forming a via holes; a step (C) for carrying out desmear treatment; a step (D) for laminating a laminated film forming a resin layer provided with a temporary support and a resin layer that contains a polymer containing a catalyst plated on the temporary support or a functional group that forms an interaction with a precursor therefor and a polymerizable group such that the resin layer and the insulating layer that has been desmear treated come into contact on the resin film and a laminate is obtained; a step (E) for peeling the temporary support off of the laminate; and a step (F) for imparting and plating the via hole walls and the catalyst plated on the resin or the precursor therefor.
Inventors:
UEKI SHIKI (JP)
Application Number:
PCT/JP2011/070437
Publication Date:
March 15, 2012
Filing Date:
September 08, 2011
Export Citation:
Assignee:
FUJIFILM CORP (JP)
UEKI SHIKI (JP)
UEKI SHIKI (JP)
International Classes:
H05K3/46; H05K3/18
Foreign References:
| JPH06148877A | 1994-05-27 | |||
| JP2010157590A | 2010-07-15 | |||
| JP2001308536A | 2001-11-02 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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