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Title:
METHOD FOR PRODUCING PERFORATED METAL FOIL
Document Type and Number:
WIPO Patent Application WO/2013/057772
Kind Code:
A1
Abstract:
This method for producing a perforated metal foil includes: a conductive substrate preparation step (S20) for preparing a conductive substrate having a structure such that an insulating layer has been formed at a second region corresponding to the position of a perforation; a metal foil formation step (S30) for forming a metal foil by means of electrodeposition at a first region that is of the conductive substrate and to which the insulating layer has not been formed; an insulating layer elimination step (S40) for eliminating the insulating layer; and a metal foil peeling step (S50) for peeling the metal foil from the conductive substrate. By means of the method for producing a perforated metal foil, degradation of perforation shape and perforation dimensions during the production process are eliminated and so it is possible to stably produce a high-quality perforated metal foil.

Inventors:
KATO KAZUHIKO (JP)
HANYU SHINICHI (JP)
KATO SOICHIRO (JP)
Application Number:
PCT/JP2011/073744
Publication Date:
April 25, 2013
Filing Date:
October 17, 2011
Export Citation:
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Assignee:
BEAC CO LTD (JP)
ASAHI GIKEN CO LTD (JP)
KATO KAZUHIKO (JP)
HANYU SHINICHI (JP)
KATO SOICHIRO (JP)
International Classes:
C25D1/08; C25D1/04
Foreign References:
JPS5492527A1979-07-21
JP2003220364A2003-08-05
JP2004091909A2004-03-25
JPS61124600A1986-06-12
JPH01222084A1989-09-05
JPS6187889A1986-05-06
JPS5382626A1978-07-21
JPS4733036A
Attorney, Agent or Firm:
MATSUO, NOBUTAKA (JP)
Masatake Matsuo (JP)
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Claims:



 
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