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Patent Searching and Data


Title:
METHOD FOR PRODUCING PHOTOSENSITIVE RESIN AND PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/029806
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for producing a photosensitive resin that has reduced chlorinity, contains fewer metal-corroding components and the like, and is excellent in terms of required properties such as adhesiveness of the cured film, in order to achieve a highly reliable printed circuit board. The method for producing this photosensitive composition is characterized by: introducing a carboxylic acid ester (c) containing a polymerizable unsaturated group to a resin (b) having an extended chain in which some or all of the phenolic hydroxyl groups in a resin (a) having two or more phenolic hydroxyl groups per molecule are extended by a (poly) oxyalkylene group having an alcoholic hydroxyl group on an end, while in the presence of a zinc or zirconium acetylacetonate complex (d), and in the range of 0.2-0.8 equivalents of the polymerizable unsaturated group per 1 equivalent of the alcoholic hydroxyl group in the resin (b); and by reacting the remaining alcoholic hydroxyl groups with a polybasic acid anhydride (e).

Inventors:
SAKAMOTO ATSUSHI (JP)
UEI HIROSHI (JP)
OGAWA KOUJI (JP)
KOBAYASHI MASAYUKI (JP)
NISHIGUCHI SHOUJI (JP)
Application Number:
PCT/JP2011/069647
Publication Date:
March 08, 2012
Filing Date:
August 30, 2011
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
SAKAMOTO ATSUSHI (JP)
UEI HIROSHI (JP)
OGAWA KOUJI (JP)
KOBAYASHI MASAYUKI (JP)
NISHIGUCHI SHOUJI (JP)
International Classes:
C08G8/28; C08L63/00; G03F7/027
Foreign References:
JP2004359728A2004-12-24
JP2004359729A2004-12-24
JP2003280189A2003-10-02
JP2003280190A2003-10-02
JP2003280191A2003-10-02
JP2000178330A2000-06-27
JPH1143524A1999-02-16
JPH02175746A1990-07-09
JPH026517A1990-01-10
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Michiharu Soga (JP)
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Claims: