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Title:
METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/149674
Kind Code:
A1
Abstract:
[Problem] To provide a production method that maintains stable quality of a polyamide resin composition that not only obtains molded articles having a higher level of appearance when the mold temperature at the time of molding is 100°C or lower but also excellent weather resistance of the appearance of the molded article surface. [Solution] A method for producing a polyamide resin composition containing (A) a crystalline polyamide resin having a polycapramide resin as a main component, (B) a semi-aromatic amorphous polyamide resin, (C) an inorganic reinforcing material, (D) a master batch of carbon black, and (E) a copper compound, wherein the (E) copper compound is made into a dispersion having a concentration of 0.04-1.0 mass%, the (A) crystalline polyamide resin having a polycapramide resin as a main component, the (B) semi-aromatic amorphous polyamide resin, the (D) master batch of carbon black, and the dispersion of (E) copper compound are premixed and introduced into the hopper of an extruder, and the (C) inorganic reinforcing material is introduced into the extruder by a side feed system.

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Inventors:
YOSHIMURA NOBUHIRO (JP)
UMEKI RYO (JP)
Application Number:
PCT/JP2021/001652
Publication Date:
July 29, 2021
Filing Date:
January 19, 2021
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L77/02; C08J3/22; C08K3/013; C08K3/04; C08K3/105; C08L77/06
Domestic Patent References:
WO2020158498A12020-08-06
Foreign References:
JP2001098149A2001-04-10
JP2002069295A2002-03-08
JP2002241606A2002-08-28
JP2015505884A2015-02-26
JP2004091707A2004-03-25
JP2006273945A2006-10-12
JP2000273299A2000-10-03
JPH02140265A1990-05-29
JPH039952A1991-01-17
JPH03269056A1991-11-29
JPH04202358A1992-07-23
JPH01263151A1989-10-19
JP2000154316A2000-06-06
Other References:
See also references of EP 4095198A4
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