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Patent Searching and Data


Title:
METHOD FOR PRODUCING RESIN ADDITIVE COMPOSITION AND RESIN ADDITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/132980
Kind Code:
A1
Abstract:
This method for producing a resin additive composition is a method for handling a compound that can be kept liquid or fluid for 30 minutes or more at 100°C as a solid, wherein said method is characterized in that 50-250 parts by mass of a compound (B) that can be kept liquid or fluid for 30 minutes or more at 100°C is contained per 100 parts by mass of a styrene elastomer (A). This resin additive composition also contains 50-250 parts by mass of a resin additive (B) having a melting point of 100°C or lower per 100 parts by mass of the styrene elastomer (A).

Inventors:
NEGISHI YOSHINORI (JP)
ISHIKAWA SHINICHI (JP)
YUNO KOICHI (JP)
Application Number:
PCT/JP2016/053899
Publication Date:
August 25, 2016
Filing Date:
February 10, 2016
Export Citation:
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Assignee:
ADEKA CORP (JP)
International Classes:
C08L53/02; C08K5/00; C08L23/06; C08L101/00
Domestic Patent References:
WO2007000876A12007-01-04
Foreign References:
JPH09241422A1997-09-16
JP2009179746A2009-08-13
JP2011527353A2011-10-27
JPS63191834A1988-08-09
JPH11513330A1999-11-16
JP2004169027A2004-06-17
Other References:
See also references of EP 3260492A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
Patent business corporation 翔和 international patent firm (JP)
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