Title:
METHOD FOR PRODUCING RESIN SEALED ELECTRONIC COMPONENT AND RESIN SEALING DEVICE FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/005027
Kind Code:
A1
Abstract:
When a resin (liquid resin) (102) is supplied to lower-die cavities (111, 112), reliability regarding the amount of resin to be supplied to the lower-die cavities (111, 112) can be efficiently increased. A resin supply plate (plate prior to resin supply) is constituted by arranging a frame (resin storage plate) (21) onto a release film (11) formed to a predetermined size, and a resin distributed plate (118) is formed by supplying a required amount of resin (liquid resin) (102) to a resin storage portion (22) of the plate prior to resin supply, and flattening (forming the upper surface of the resin to a horizontal surface). Next, the resin distributed plate (118) is arranged at the position of the lower-die cavities (111, 112), and the release film (11) is drawn into the lower-die cavities (111, 112), so that the release film (11) and the flattened required amount of resin (liquid resin) (102) are dropped together and the resin (liquid resin) (102) is supplied to the cavities (111, 112) covered by the release film (11).
Inventors:
URAGAMI HIROSHI (JP)
TAKADA NAOKI (JP)
OTSUKI OSAMU (JP)
TAKADA NAOKI (JP)
OTSUKI OSAMU (JP)
Application Number:
PCT/JP2011/056867
Publication Date:
January 12, 2012
Filing Date:
March 22, 2011
Export Citation:
Assignee:
TOWA CORP (JP)
URAGAMI HIROSHI (JP)
TAKADA NAOKI (JP)
OTSUKI OSAMU (JP)
URAGAMI HIROSHI (JP)
TAKADA NAOKI (JP)
OTSUKI OSAMU (JP)
International Classes:
B29C43/18; B29C43/34; H01L21/56; B29L31/34
Domestic Patent References:
| WO2010016223A1 | 2010-02-11 |
Foreign References:
| JP2004148621A | 2004-05-27 |
Attorney, Agent or Firm:
TSUJIMARU Koichiro et al. (JP)
Koichiro Tsujimaru (JP)
Koichiro Tsujimaru (JP)
Download PDF:
Claims: