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Title:
METHOD FOR PRODUCING SEALED OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/049791
Kind Code:
A1
Abstract:
Provided is a method for producing a sealed optical semiconductor device that makes it possible to seal an optical semiconductor element in a highly reliable manner even when the physical properties of a sealing film in an inner layer include poor stretchability. The present invention includes the following steps: a step in which at least two types of sealing films including an inner layer sealing film and an outermost layer sealing film are placed in this order on an optical semiconductor element placement substrate on which an optical semiconductor element is placed within a pressure reduction chamber and the pressure in the pressure reduction chamber is reduced; a step in which the outermost layer sealing film is heated and at least the periphery of the outermost layer sealing film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the pressure reduction chamber is released and the optical semiconductor element placement substrate is sealed by the outermost layer sealing film and the inner layer sealing film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the pressure reduction chamber is released is a temperature at which the outermost layer sealing film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner layer sealing film exhibits a loss tangent (tan δ) of 1.6 or more at the temperature T2.

Inventors:
KITAURA EIJI (JP)
AMAKO MASAAKI (JP)
SWIER STEVEN (US)
Application Number:
PCT/JP2018/032424
Publication Date:
March 14, 2019
Filing Date:
August 31, 2018
Export Citation:
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Assignee:
DOW CORNING TORAY CO LTD (JP)
DOW SILICONES CORP (US)
International Classes:
H01L33/54; H01L33/50; H01L33/56
Domestic Patent References:
WO2005105428A12005-11-10
WO2017057074A12017-04-06
WO2012023119A12012-02-23
WO2016065016A12016-04-28
Foreign References:
JP2016201546A2016-12-01
US20130319607A12013-12-05
JP2017172929A2017-09-28
JP2016171314A2016-09-23
JP2016171315A2016-09-23
Other References:
See also references of EP 3680943A4
Attorney, Agent or Firm:
MURAYAMA Yasuhiko et al. (JP)
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