Title:
METHOD FOR PRODUCING SEALING RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2013/054677
Kind Code:
A1
Abstract:
Provided is a method for producing a sealing resin sheet whereby bubble trails are less likely to occur on the surface. A liquid resin (21) containing no solvent is placed in a mold (20) and brought to a semi-cured state by heat treatment to form a resin body (22) containing no solvent. The formed resin body (22) is supplied to one side of a first pressure plate (23), heated at a temperature lower than the curing temperature, compressed while clamped between the first pressure plate (23) and a second pressure plate (25), and stretched in the direction of the plane of the first pressure plate (23) and the second pressure plate (25), to form a sealing resin sheet (1) containing no solvent.
Inventors:
IDA YUYA (JP)
KITAYAMA HIROKI (JP)
KATSUBE AKIO (JP)
WATANABE KOJI (JP)
KITAYAMA HIROKI (JP)
KATSUBE AKIO (JP)
WATANABE KOJI (JP)
Application Number:
PCT/JP2012/075365
Publication Date:
April 18, 2013
Filing Date:
October 01, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B29C43/02; B29B11/06; B29C43/18; H01L21/56; B29L31/34
Foreign References:
| JP2010179507A | 2010-08-19 | |||
| JP2000290471A | 2000-10-17 | |||
| JP2010003857A | 2010-01-07 | |||
| JPH0966523A | 1997-03-11 |
Attorney, Agent or Firm:
FUKUNAGA Masaya (JP)
Masaya Fukunaga (JP)
Masaya Fukunaga (JP)
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Claims:
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