Title:
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/080255
Kind Code:
A1
Abstract:
The present invention discloses a method for producing a semiconductor device. The method for producing a semiconductor device comprises: a resin film formation step for forming, on a semiconductor wafer, a resin film including a resin which is subjected to reduction in molecular weight when irradiated with light; a resin-film-piece-attached semiconductor chip creation step for dicing, by means of a dicing blade, the semiconductor wafer having the resin film formed thereon, and creating resin-film-piece-attached semiconductor chips which are formed into individual pieces; and a resin-film-piece removal step for irradiating resin film pieces on the resin-film-piece-attached semiconductor chips with light, and removing the resin film pieces from the resin-film-piece attached semiconductor chips.
Inventors:
MIYAMOTO YUKI (JP)
CHOI HAEMIL (JP)
IWANAGA YUKIHIRO (JP)
WADA MASAYUKI (JP)
SAKAMOTO KEIICHI (JP)
WATANABE MASAHITO (JP)
KONDO HIDEKAZU (JP)
SAITO KOICHI (JP)
CHOI HAEMIL (JP)
IWANAGA YUKIHIRO (JP)
WADA MASAYUKI (JP)
SAKAMOTO KEIICHI (JP)
WATANABE MASAHITO (JP)
KONDO HIDEKAZU (JP)
SAITO KOICHI (JP)
Application Number:
PCT/JP2023/036611
Publication Date:
April 18, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/301; C08G59/66; H01L21/304
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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