Title:
METHOD FOR PRODUCING SIGNAL CONVERSION SUBSTRATE, AND PRODUCTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/113213
Kind Code:
A1
Abstract:
Provided are a method for producing a signal conversion substrate and a production device which make it possible to produce, by additive fabrication, a signal conversion substrate to which a plurality of connectors are connected. A method for producing a signal conversion substrate according to the present disclosure comprises: a pin information acquisition step for acquiring pin information pertaining to the correspondence between a plurality of first pins provided in a first connector and a plurality of second pins provided in a second connector; a substrate fabrication step for fabricating a substrate by additive fabrication in which an electrically insulating material is used to stack insulating layers; a wire fabrication step for fabricating a plurality of wires, to which the plurality of first pins and the plurality of second pins are connected, in an arbitrary insulating layer in the substrate by additive fabrication on the basis of the pin information; and an attachment portion step for providing, in the substrate, a first attachment portion for connecting the first pins with the wire and a second attachment portion for connecting the second pins with the wire.
Inventors:
FUJITA MASATOSHI (JP)
Application Number:
PCT/JP2020/043846
Publication Date:
June 02, 2022
Filing Date:
November 25, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
B33Y10/00; H05K3/00; H05K3/12
Foreign References:
| JP2018500632A | 2018-01-11 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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