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Title:
METHOD FOR PRODUCING SILICONE-CONTAINING COPOLYMER MOLDED ARTICLE HAVING HYDROPHILIC SURFACE, AND SILICONE HYDROGEL CONTACT LENS HAVING HYDROPHILIC SURFACE
Document Type and Number:
WIPO Patent Application WO/2015/001811
Kind Code:
A1
Abstract:
Provided is a method for producing, using a cast molding production method, a silicone-containing copolymer molded article which has a hydrophilic surface without using a high molecular weight hydrophilic polymer and even if a polypropylene molding die is used. Also provided is a silicone hydrogel soft contact lens. This method for producing a silicone-containing copolymer molded article having a hydrophilic surface involves polymerizing a monomer solution that contains (a) a silicone monomer having a (meth)acryloyl group, (b) a hydrophilic monomer having a vinyl group, (c) a crosslinkable monomer and (d) a polymerization initiator in a cavity of a molding die having a hydrophobic cavity surface. The polymerization initiator has a 10 hour half-life temperature (T10) of 70-100°C, and the polymerization is carried out in a P1 step, in which the temperature is maintained for one hour or longer within a temperature range between the T10 value of the polymerization initiator contained in the monomer solution and a temperature that is 35°C lower than the T10 value, and a P2 step, in which the temperature is maintained for one hour or longer at a temperature that is higher than the T10 value of the polymerization initiator contained in the monomer solution.

Inventors:
IMAFUKU SUGURU (JP)
Application Number:
PCT/JP2014/051031
Publication Date:
January 08, 2015
Filing Date:
January 21, 2014
Export Citation:
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Assignee:
HOYA CORP (JP)
International Classes:
B29C39/38; B29C33/40; C08F230/08; C08F290/06; G02C7/04; B29K101/10; B29L11/00
Domestic Patent References:
WO2012016152A12012-02-02
WO2012006485A22012-01-12
WO1993009154A11993-05-13
WO2008061992A22008-05-29
WO2012118680A12012-09-07
Foreign References:
JP2008083649A2008-04-10
JP2008020918A2008-01-31
JP2011153304A2011-08-11
JPH07505169A1995-06-08
JP2011219512A2011-11-04
JP2010510550A2010-04-02
US20130031873A12013-02-07
JPS5515110A1980-02-02
US4139692A1979-02-13
JPS63163811A1988-07-07
JP2001323024A2001-11-20
JP2002113089A2002-04-16
US20040014921A12004-01-22
JP2002182167A2002-06-26
US4395496A1983-07-26
JPH04332760A1992-11-19
JP2001311917A2001-11-09
JP2001183502A2001-07-06
JPH11502949A1999-03-09
JP2005538767A2005-12-22
Other References:
See also references of EP 2845708A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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