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Patent Searching and Data


Title:
METHOD FOR PRODUCING STRIPPING FILM FOR PRODUCING THIN FILM, METHOD FOR PRODUCING THIN FILM FOR ELECTRONIC COMPONENT, AND STRIPPING FILM FOR PRODUCING THIN FILM
Document Type and Number:
WIPO Patent Application WO/2002/064338
Kind Code:
A1
Abstract:
A method for producing a stripping film (1) for producing a thin film for electronic component by coating a base film (2) with coating liquid (3a) containing silicone resin, drying the coating liquid (3a) to form a stripping layer (3) of silicone resin on the base film (2) and then winding the base film (2), on which the stripping layer (3) is formed, into a roll, wherein the base film (2) is wound while applying a tension in the range of 3-17 N per 100 mm width of the base film (2) on which the stripping layer (3) is formed when the thickness of the base film (2) is in the range of 5-30 $g(m)m. Flatness on the surface of the stripping layer (3) can be ensured while preventing the winding state from ravel or the base film (2) from stretching.

Inventors:
IIDA SHUJI
MIYABARA HIROYUKI
KAWASAKI KAORU
Application Number:
PCT/JP2002/001210
Publication Date:
August 22, 2002
Filing Date:
February 13, 2002
Export Citation:
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Assignee:
TDK CORP (JP)
International Classes:
B05D7/00; B05D7/24; B28B1/30; B29C33/64; B29C33/68; B29C37/00; B32B27/00; C08J7/04; B05D7/04; (IPC1-7): B28B1/30; B05D7/04; B32B27/36; C08J7/04
Foreign References:
JP2002052671A2002-02-19
JPH10229027A1998-08-25
JPH1016163A1998-01-20
JPH09248890A1997-09-22
Attorney, Agent or Firm:
Sakai, Shinji (Higashiterao Matsushiro-machi Nagano-shi, Nagano, JP)
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