Title:
METHOD FOR PRODUCING SYNTHETIC RESIN MOLDED BODY, AND METHOD FOR PRODUCING METAL RESIN JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2020/183747
Kind Code:
A1
Abstract:
A method for producing a metal-resin bonded body 30 according to the present invention has: a first step for, while heating at least the surface of a synthetic resin substrate 12 to a first temperature that is at least the glass transition temperature of a thermoplastic resin, and is at most the decomposition temperature of the thermoplastic resin, exposing the surface of the synthetic resin substrate 12 to an oxygen-containing gas which is heated to a second temperature that is at least the melting point of the thermoplastic resin, and forming a surface layer portion 14 which has a functional group capable of undergoing a neutralization reaction with a basic or amphoteric oxide, and being chemically bonded, on the surface of the synthetic resin substrate 12; and a second step for, while heating the metal substrate 20 on which an oxide film having a basic or amphoteric oxide is formed on the surface of the metal and the synthetic resin substrate 12, arranging an oxide film 22 and the surface layer portion 14 between the metal substrate 20 and the synthetic resin substrate 12, and bonding the metal substrate 20 and the synthetic resin substrate 12. Due to said feature, the bonding strength between the metal substrate 20 and the synthetic resin substrate 12 can be improved.
Inventors:
SAI SEIICHI (JP)
Application Number:
PCT/JP2019/026368
Publication Date:
September 17, 2020
Filing Date:
July 02, 2019
Export Citation:
Assignee:
MUTSUKI ELECTRIC CO LTD (JP)
International Classes:
B29C65/44; B29C35/02; B29C45/14; B29C65/46
Domestic Patent References:
| WO2014157289A1 | 2014-10-02 | |||
| WO2019026331A1 | 2019-02-07 |
Foreign References:
| JP2011168036A | 2011-09-01 | |||
| JP2013107325A | 2013-06-06 |
Attorney, Agent or Firm:
TSUTADA, Masato et al. (JP)
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