Title:
METHOD FOR PRODUCING THERMALLY CONDUCTIVE RESIN MOLDING
Document Type and Number:
WIPO Patent Application WO/2010/021408
Kind Code:
A1
Abstract:
Disclosed is a method for producing a thermally conductive resin molding containing binder resin (18), and thermally conductive inorganic filler powder (19) dispersed into the binder resin (18) while containing flat particles having anisotropy in thermal conductivity wherein thermal conductivity can be improved sharply in an arbitrary direction, e.g. the thickness direction of the molding, and increase in cost can be restrained. A molding is obtained via a step for preparing a mixture (P) by mixing uncured binder resin (18) and inorganic filler powder (19), a step for exhausting air in the molding cavity (17) of a molding die (12), a step for injecting the mixture (P) into the molding cavity (17) from an injection opening (16) communicating with the molding cavity (17), and a step for curing the mixture (P) injected into the molding cavity (17).
Inventors:
KAWAI TOMOYUKI (JP)
IMAOKA KO (JP)
KINOSHITA KYOICHI (JP)
TANIZAWA MOTOHARU (JP)
IMAOKA KO (JP)
KINOSHITA KYOICHI (JP)
TANIZAWA MOTOHARU (JP)
Application Number:
PCT/JP2009/064903
Publication Date:
February 25, 2010
Filing Date:
August 20, 2009
Export Citation:
Assignee:
TOYOTA JIDOSHOKKI KK (JP)
KAWAI TOMOYUKI (JP)
IMAOKA KO (JP)
KINOSHITA KYOICHI (JP)
TANIZAWA MOTOHARU (JP)
KAWAI TOMOYUKI (JP)
IMAOKA KO (JP)
KINOSHITA KYOICHI (JP)
TANIZAWA MOTOHARU (JP)
International Classes:
B29C39/02; B29C39/24; B29C39/42; B29K105/18
Foreign References:
| JP2004256687A | 2004-09-16 | |||
| JP2003062839A | 2003-03-05 | |||
| JP2008036997A | 2008-02-21 | |||
| JPH03150115A | 1991-06-26 | |||
| JPH0474612A | 1992-03-10 | |||
| JPS62164512A | 1987-07-21 | |||
| JP2003266453A | 2003-09-24 | |||
| JP2002086464A | 2002-03-26 | |||
| JP2001062850A | 2001-03-13 | |||
| JP2000185328A | 2000-07-04 |
Attorney, Agent or Firm:
OHKAWA, HIROSHI (JP)
Hiroshi Okawa (JP)
Hiroshi Okawa (JP)
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