Title:
METHOD FOR PRODUCING WAFER LENS
Document Type and Number:
WIPO Patent Application WO/2011/148756
Kind Code:
A1
Abstract:
Disclosed is a method for producing a wafer lens provided with a lens portion made of a photo-curable resin on one surface of a substrate, wherein the method is provided with a dispensing step for dispensing a photo-curable resin material to at least one of a molding die having a molding surface shaped to correspond to a shape of the optical surface of the lens portion, and the one surface of the substrate; a curing step, performed after the dispensing step, to press the photo-curable resin material by relatively bringing the molding die and the substrate closer and cure the photo-curable resin material by irradiating light; and a releasing step, performed after the curing step, to release the lens portion formed by curing from the molding die; wherein the photo-curable resin material is heated and dispensed in the dispensing step.
Inventors:
ARAI KEIJI (JP)
Application Number:
PCT/JP2011/060349
Publication Date:
December 01, 2011
Filing Date:
April 28, 2011
Export Citation:
Assignee:
KONICA MINOLTA OPTO INC (JP)
ARAI KEIJI (JP)
ARAI KEIJI (JP)
International Classes:
B29C39/24; B29C39/44; G02B3/00; B29L11/00
Foreign References:
| JP2010105357A | 2010-05-13 | |||
| JP2008229861A | 2008-10-02 | |||
| JP2006030633A | 2006-02-02 | |||
| JP2008046469A | 2008-02-28 | |||
| JPH06201903A | 1994-07-22 |
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Mitsuaki international patent firm (JP)
Patent business corporation Mitsuaki international patent firm (JP)
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