METHOD FOR PRODUCING WIRING BOARD AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

WIPO Patent Application WO/2020/262345

A1

The present invention provides a method for producing a wiring board, said method being capable of forming a metal wiring line having excellent conductivity especially on a substrate such as a polymer insulating film that does not have high heat resistance.　A method for producing a wiring board according to the present invention is characterized by comprising: an arrangement step wherein a conductive paste that contains metal particles containing one or more metal elements selected from among copper, silver and nickel is arranged on a substrate; a first heating step wherein the substrate is heated at a temperature of 200°C or more but less than 400°C in an atmosphere having an oxygen concentration of from 0.5% by volume to 30% by volume (inclusive); and a second heating step wherein the substrate is heated at a temperature of 200°C or more but less than 400°C in an atmosphere containing a reducing gas. This method for producing a wiring board is also characterized in that the metal particles contained in the conductive paste have a particle size distribution wherein the average particle diameter is from 80 nm to 15 μm (inclusive). It is preferable that this method for producing a wiring board additionally comprises a low temperature pressurization step wherein a pressure of from 1 MPa to 10 MPa (inclusive) is applied to a sintered body, which is formed from the conductive paste, at a temperature of less than 100°C after the second heating step.

KOIKE JUNICHI (JP)

PCT/JP2020/024517

December 30, 2020

June 23, 2020

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MAT CONCEPT INC (JP)

H01B1/22; H01B5/16; H01B13/00; H05K1/09; H05K3/12

JP2017069201A	2017-04-06
JP2005177710A	2005-07-07
JP2014534605A	2014-12-18

IWAIKE Mitsuru et al. (JP)

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