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Title:
METHOD FOR PRODUCING WIRING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/089744
Kind Code:
A1
Abstract:
Disclosed is a method for producing a wiring structure. This method for producing a wiring structure comprises: a step for forming, on a support substrate, a modification region that is along the main surface of the support substrate and that is exposed on the main surface; a step for forming, on the main surface, a conductor layer so that the conductor layer is in close contact with the modification region; a step for forming wiring on the conductor layer; a step for forming an insulating layer on the conductor layer so that the insulating layer covers the wiring; a step for separating the support substrate from the conductor layer; and a step for removing the conductor layer.

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Inventors:
TOBA MASAYA (JP)
MITSUKURA KAZUYUKI (JP)
Application Number:
PCT/JP2022/039544
Publication Date:
May 02, 2024
Filing Date:
October 24, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
H01L23/12
Foreign References:
JP2005317901A2005-11-10
JP2007109858A2007-04-26
JP2010045215A2010-02-25
JP2021057395A2021-04-08
JP2016219711A2016-12-22
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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