METHOD FOR THE PRODUCTION OF ELECTRICALLY-CONDUCTING CONNECTIONS ON CHIPCARDS

Title:

METHOD FOR THE PRODUCTION OF ELECTRICALLY-CONDUCTING CONNECTIONS ON CHIPCARDS

Document Type and Number:

WIPO Patent Application WO2004006173

Kind Code:

A3

Abstract:

The invention relates to a method for the production of an electrically-conducting connection between coil contact surfaces and the chip module of a data support, in particular a chipcard. An adhesive is used for the above, characterised in having a limited conductivity.

Inventors:

RIEDL JOSEF (DE)
WELLING ANDO (DE)

Application Number:

PCT/EP2003/007070

Publication Date:

January 27, 2005

Filing Date:

July 02, 2003

Export Citation:

Click for automatic bibliography generation Help

Assignee:

GIESECKE & DEVRIENT GMBH (DE)
RIEDL JOSEF (DE)
WELLING ANDO (DE)

International Classes:

G06K19/077; H05K3/32; H05K1/18; (IPC1-7): G06K19/077

Foreign References:

DE19709985A1	1998-09-17
US5647122A	1997-07-15

Download PDF:

View/Download PDF PDF Help

Previous Patent: PORTABLE DATA CARRIER WITH A POLYMER-BASED INTEGRATED CIRCUIT

Next Patent: TRANSPONDER CIRCUIT