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Patent Searching and Data


Title:
METHOD FOR REMOVING ADHERED METALS FROM METAL PLATE
Document Type and Number:
WIPO Patent Application WO/2019/073819
Kind Code:
A1
Abstract:
The purpose of the present invention is to enable one or more kinds of metals adhered to a metal plate to be dissolved at the same time, thereby reducing the time spent removing the adhered metals. This method for removing adhered metals from a metal plate does so by means of an electrolytic device using a flat direct-current voltage and is characterized in that after the metal plate with adhered metals is immersed in an electrolytic solution, electrolysis is conducted using the metal plate as an anode with an anode potential of 0.1-3.0 V (Ag/AgCl reference electrode), thereby removing the adhered metals from the metal plate.

Inventors:
MATSUI TAISUKE (JP)
MURONOSONO TAKASHI (JP)
Application Number:
PCT/JP2018/036234
Publication Date:
April 18, 2019
Filing Date:
September 28, 2018
Export Citation:
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Assignee:
MATSUDA SANGYO COMPANY LTD (JP)
International Classes:
C25F5/00; C23C16/44
Domestic Patent References:
WO2015034797A12015-03-12
Foreign References:
JP2002242000A2002-08-28
JP2008150708A2008-07-03
JP2004115918A2004-04-15
Other References:
BOUCHAUD, B. ET AL.: "Controlled stripping of aluminide coatings on nickel superalloys through electrolytic techniques", JOURNAL OF APPLIED ELECTROCHEMISTRY, vol. 38, no. 6, 2008, pages 817 - 825, XP019606245
Attorney, Agent or Firm:
OGOSHI Kazuteru et al. (JP)
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