Title:
METHOD FOR REMOVING ADHEREND AND ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/024541
Kind Code:
A1
Abstract:
A method for removing an adherend according to the present invention comprises a first step and a second step. In the first step, a bonded body (100) which comprises an adhesive layer (10) and an adherend (20) bonded to the adhesive layer is prepared. The adhesive layer (10) contains an adhesive component and a thermally expandable agent. In the second step, the adherend (20) is irradiated with an energy ray (R) from the adhesive layer (10) side of the bonded body (100). The adhesive layer (10) has a transmittance of the energy ray (R) of 60% or more. An adhesive composition according to the present invention is used for the purpose of forming the adhesive layer (10) in the above-described method.
Inventors:
NAGATA MIZUHO (JP)
TACHIKAWA YU (JP)
HIRANO KEISUKE (JP)
MATSUSHITA KIICHIRO (JP)
TACHIKAWA YU (JP)
HIRANO KEISUKE (JP)
MATSUSHITA KIICHIRO (JP)
Application Number:
PCT/JP2020/012197
Publication Date:
February 11, 2021
Filing Date:
March 19, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/00; C09J11/06; C09J201/00; H01L21/301; H01L21/304
Foreign References:
| JP2015124300A | 2015-07-06 | |||
| JP2004186280A | 2004-07-02 | |||
| JP2005097507A | 2005-04-14 | |||
| JP2004133140A | 2004-04-30 | |||
| JP2017191283A | 2017-10-19 | |||
| JP2012167178A | 2012-09-06 | |||
| JP2003231867A | 2003-08-19 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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