Title:
METHOD FOR REMOVING ORGANIC AGENT CONTAINED IN PLATING LIQUID, AND METHOD FOR REGENERATING PLATING LIQUID
Document Type and Number:
WIPO Patent Application WO/2022/163866
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for removing an organic agent (organic additive and decomposition product thereof) from a used plating liquid by a technique that is easier and simpler, and a method for regenerating a plating liquid. In order to achieve this purpose, the present invention employs a method for removing an organic agent contained in a plating liquid, characterized by introducing ozone bubbles into a used plating liquid after a plating operation and oxidatively decomposing the organic agent. In addition, the present invention employs a method for regenerating a plating liquid, characterized by performing a UV radiation process or a heating process on the organic-agent-removed plating liquid from which a residual organic agent has been removed using the above method, and removing the ozone bubbles remaining in the solution to produce a regenerated plating liquid.
Inventors:
UMEDA YASUSHI (JP)
HONMA HIDEO (JP)
HONMA HIDEO (JP)
Application Number:
PCT/JP2022/003828
Publication Date:
August 04, 2022
Filing Date:
February 01, 2022
Export Citation:
Assignee:
KANTO GAKUIN SCHOOL CORP (JP)
International Classes:
C25D21/18; C02F1/78
Foreign References:
| JP2003535223A | 2003-11-25 |
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (JP)
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