Title:
METHOD FOR REMOVING SKIN OF ONION AND DEVICE FOR REMOVING SKIN OF ONION
Document Type and Number:
WIPO Patent Application WO/2024/038728
Kind Code:
A1
Abstract:
The present invention provides a method and a device for removing the skin of onion, which are capable of easily removing the skin of onion, and preventing an edible portion of onion from being damaged during the removal of the skin. The method for removing the skin of onion according to the present invention comprises: a step A for irradiating the skin of onion with a laser beam under conditions that allow selective cutting of the skin, to create a cut line in the skin; and a step B for removing the skin having the cut line from the onion. The wavelength of the laser is 300-500 nm.
Inventors:
HARA HIROFUMI (JP)
SHIGA DAIZO (JP)
KUBOTA AKIRA (JP)
MATSUO KAZUHIDE (JP)
WAKAMATSU RYU (JP)
KAMISHINA NOBORU (JP)
SHIGA DAIZO (JP)
KUBOTA AKIRA (JP)
MATSUO KAZUHIDE (JP)
WAKAMATSU RYU (JP)
KAMISHINA NOBORU (JP)
Application Number:
PCT/JP2023/026429
Publication Date:
February 22, 2024
Filing Date:
July 19, 2023
Export Citation:
Assignee:
TAISEI DENKI CO LTD (JP)
International Classes:
A23N15/08; A23N12/02; B26D7/18; B26F3/00; G01C3/06
Foreign References:
| JP2007135570A | 2007-06-07 | |||
| JP2005204606A | 2005-08-04 | |||
| JP5787424B1 | 2015-09-30 |
Attorney, Agent or Firm:
AKATSUKA Masaki et al. (JP)
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