METHOD OF RESIN-SEALING SEMICONDUCTOR DEVICES

Title:

METHOD OF RESIN-SEALING SEMICONDUCTOR DEVICES

Document Type and Number:

WIPO Patent Application WO/1995/019251

Kind Code:

A1

Abstract:

The method according to the present invention is carried out by setting a circuit board (9), on which an IC 15 is mounted, in a cavity (11) of a lower metal mold (2) so that the IC faces in the downward direction, feeding a resin tablet (19) from a pot (21) formed in a position lower than the cavity (11), pressing a molten resin with a plunger (20) and packing the resin in the cavity (11) through a runner (18) and a pinpoint gate formed at a lower portion of the cavity, and pressing a rear surface of the circuit board (9) with a pressing member (3) provided in an upper metal mold, whereby the IC 15 mounted on the circuit board (9) is resin-sealed. Consequently, the present invention makes it possible to prevent the occurrence of residual resin which causes the imperfect packing of the cavity with a resin, improve the productivity of semiconductor devices, and mold semiconductor devices having a high reliability and a high quality.

Inventors:

YABE ISAO (JP)
YONEYAMA MASAHIKO (JP)
NAYUKI TERUO (JP)
SHIMIZU HIROAKI (JP)
IKAI KATSUHIKO (JP)
ASAUMI KAZUHIKO (JP)

Application Number:

PCT/JP1995/000007

Publication Date:

July 20, 1995

Filing Date:

January 06, 1995

Export Citation:

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Assignee:

CITIZEN WATCH CO LTD (JP)
YABE ISAO (JP)
YONEYAMA MASAHIKO (JP)
NAYUKI TERUO (JP)
SHIMIZU HIROAKI (JP)
IKAI KATSUHIKO (JP)
ASAUMI KAZUHIKO (JP)

International Classes:

B29C45/02; B29C45/14; B29C45/38; H01L21/56; (IPC1-7): B29C45/02; B29C45/14; B29C45/18; B29C45/26; H01L21/56

Foreign References:

JPS51137377A	1976-11-27
JPS59154032A	1984-09-03
JPH05293846A	1993-11-09

Other References: