Title:
METHOD FOR SEALING ELECTRIC/ELECTRONIC COMPONENT AND SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2014/185325
Kind Code:
A1
Abstract:
[Problem] To provide a method for forming a low-pressure insert seal for an electric/electronic component and able to manifest favorable adhesion with respect to olefin resins such as polyethylene and polypropylene that are poorly adhesive materials. [Solution] The method for sealing an electric/electronic component is characterized by the electric/electronic component being subjected to atmospheric-pressure plasma treatment during insert molding/sealing of the electric/electronic component at a temperature no greater than 260°C and a pressure of no greater than 20 MPa using a resin composition having as the primary component a crystalline copolymer polyester having a glass transition temperature of no greater than 0°C and a melting point of 120-240°C inclusive.
Inventors:
NAKAJIMA TADASHI (JP)
Application Number:
PCT/JP2014/062309
Publication Date:
November 20, 2014
Filing Date:
May 08, 2014
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
H01L23/28; B29C45/00; B29C45/14; C08J7/00; C08L23/00; C08L67/00; C08L101/00; H01B3/42; H01L21/56; H01L23/29; H01L23/31; H01B3/30
Domestic Patent References:
| WO2012115065A1 | 2012-08-30 |
Foreign References:
| JP2010150471A | 2010-07-08 | |||
| JP2002270623A | 2002-09-20 | |||
| JPH0837200A | 1996-02-06 |
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