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Patent Searching and Data


Title:
METHOD FOR SEGMENTING SUBSTRATE HAVING METAL FILM
Document Type and Number:
WIPO Patent Application WO/2019/082736
Kind Code:
A1
Abstract:
Provided is a method with which it is possible to suitably segment a substrate having a metal film. A method for segmenting a substrate having a metal film, the method comprising: a step for forming a scribe line by scribing a first-main-surface side, on which no metal film is provided, at a prescribed position intended for segmenting, and extending a vertical crack in the substrate interior along the position intended for segmenting; a step for further extending the vertical crack by bringing a breaking bar into contact with the substrate having a metal film from a second-main-surface side, on which a metal film is provided, and thereby segmenting a portion other than the metal film at the position intended for segmenting; and a step for segmenting the metal film at the position intended for segmenting by bringing the breaking bar into contact with the substrate having a metal film from the first-main-surface side.

Inventors:
MURAKAMI KENJI (JP)
Application Number:
PCT/JP2018/038482
Publication Date:
May 02, 2019
Filing Date:
October 16, 2018
Export Citation:
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Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
H01L21/301; B28D5/00
Foreign References:
JP2014065633A2014-04-17
JP2015083336A2015-04-30
JP2017041525A2017-02-23
JPS56148842A1981-11-18
JP2012146879A2012-08-02
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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