Title:
METHOD OF SOLDERING ELECTRONIC COMPONENT, AND APPARATUS OF SAME
Document Type and Number:
WIPO Patent Application WO/2010/103861
Kind Code:
A1
Abstract:
A method of soldering an electronic component, which is free of leftover solder existing between electrodes and allows a suitable amount of liquid solder to stick to the electrodes. A chip coil (1) is supported above the liquid solder surface so that the direction in which the pair of electrodes face each other is parallel to the liquid solder surface, and is swung about a first axis (X1), which is positioned below the liquid solder surface, as a center of rotation so that the left and right electrodes (3c, 3d) are alternately dipped into the liquid solder surface. Next, after horizontally holding the chip coil above the liquid solder surface and in a state in which the liquid solder is connected to the electrode through surface tension, the chip coil is rotated upward about a second axis (Y1) as a center of rotation, and liquid solder is shaken off from the electrodes. As liquid solder does not contact the region between the electrodes during dipping and pull-up, leftover solder does not appear between the electrodes.
Inventors:
HIGAKI TADANORI (JP)
OIKAWA TAKASHI (JP)
TOMIZAWA YOSUKE (JP)
OIKAWA TAKASHI (JP)
TOMIZAWA YOSUKE (JP)
Application Number:
PCT/JP2010/050270
Publication Date:
September 16, 2010
Filing Date:
January 13, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
HIGAKI TADANORI (JP)
OIKAWA TAKASHI (JP)
TOMIZAWA YOSUKE (JP)
HIGAKI TADANORI (JP)
OIKAWA TAKASHI (JP)
TOMIZAWA YOSUKE (JP)
International Classes:
H01F41/10; B23K1/00; B23K1/08; B23K3/00
Foreign References:
| JPS60151671U | 1985-10-08 | |||
| JPH04320016A | 1992-11-10 | |||
| JPH0550223A | 1993-03-02 | |||
| JP2001230144A | 2001-08-24 | |||
| JPS6163355A | 1986-04-01 | |||
| JP2007317725A | 2007-12-06 |
Attorney, Agent or Firm:
TSUTSUI HIDETAKA (JP)
Hidetaka Tsutsui (JP)
Hidetaka Tsutsui (JP)
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