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Title:
METHOD FOR SURFACE BRAZING BETWEEN ALUMINUM ALLOY MEMBER AND COPPER ALLOY MEMBER
Document Type and Number:
WIPO Patent Application WO/2013/108465
Kind Code:
A1
Abstract:
A method for flux-free surface brazing between an aluminum alloy member and a copper alloy member using a single-layer brazing sheet, wherein: in a state in which a single-layer brazing sheet comprising a brazing material having a component composition containing 1.0 to 12% Si by mass and 0.1 to 5.0% Mg by mass with the remainder being made up by Al and unavoidable impurities and having a thickness of 15 to 200 μm is sandwiched between the aluminum alloy member and the copper alloy member so as to be in surface contact, the aluminum alloy member and the copper alloy member are brazed flux-free in an inert gas atmosphere while a surface pressure of no less than 0.6 MPa is applied and the brazing temperature is held at 510 to 550ºC.

Inventors:
KOKUBO TAKANORI (JP)
HORI HISASHI (JP)
TOGASHI RYOSUKE (JP)
Application Number:
PCT/JP2012/078497
Publication Date:
July 25, 2013
Filing Date:
November 02, 2012
Export Citation:
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Assignee:
NIPPON LIGHT METAL CO (JP)
International Classes:
B23K1/19; B23K1/00; B23K3/06; B23K31/02; B23K35/14; B23K35/22; B23K35/28; C22C21/00; B23K101/14; B23K103/18
Foreign References:
JP2002113569A2002-04-16
JP2004303818A2004-10-28
JP2009226454A2009-10-08
JP2000343210A2000-12-12
JPH1190620A1999-04-06
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
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Claims: