Title:
METHOD FOR SURFACE-TREATING MOLD
Document Type and Number:
WIPO Patent Application WO/2017/175463
Kind Code:
A1
Abstract:
Provided is a method for surface-treating a mold with which a simple treatment makes it possible, at low cost and in short time, to obtain simultaneously an improvement in mold release performance and an improvement in the surface hardness of the mold. In the present invention, a pre-treatment step is performed, in which the surface of a mold is adjusted, by, for example: dry-spraying a carbide powder having a grain size of #220 (JIS R6001-1987) or lower and a polygonal shape at a spray pressure of 0.2 MPa or higher onto the surface of a mold, to diffuse, on the surface of the mold, a carbon element that is in the carbide powder; and removing machining marks occurring on the surface of the mold. Thereafter, a post-treatment step is performed, in which a spherical powder having a hardness at least equivalent to the base material hardness of the mold and a grain size of #220 or lower is dry-sprayed at a spray pressure of 0.2 MPa or higher and made to impact the mold, to form countless minute indentations of arcuate shape on the surface of the mold.
Inventors:
MIYASAKA YOSHIO (JP)
Application Number:
PCT/JP2017/003607
Publication Date:
October 12, 2017
Filing Date:
February 01, 2017
Export Citation:
Assignee:
FUJI KIHAN CO LTD (JP)
International Classes:
C23C8/80; B24C1/06; B24C3/32; B24C11/00; B29C33/38; C23C8/22
Domestic Patent References:
| WO2010023714A1 | 2010-03-04 |
Foreign References:
| JP2005002457A | 2005-01-06 | |||
| JP2012040744A | 2012-03-01 | |||
| JP2006297811A | 2006-11-02 |
Other References:
See also references of EP 3441500A4
Attorney, Agent or Firm:
OGURA & CO. (JP)
Download PDF: