METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART

WIPO Patent Application WO/2019/022039

A1

Provided are a method for synthesizing a copper-silver alloy, whereby a copper-silver alloy can easily be synthesized at low temperature and in a short time, a method for forming a conduction part, and a copper-silver alloy and a conduction part. The present invention is provided with an ink preparation step for preparing a copper-silver ink by mixing copper salt particles, an amine-based solvent, and silver salt particles, an application step for applying the copper-silver ink to a member to be coated, a nucleation step for generating copper crystal nuclei having a crystal grain size of 0.2 µm or less and/or silver crystal nuclei having a crystal grain size of 0.2 µm or less from the copper-silver ink, and a crystal nucleus synthesis step for synthesizing the copper crystal nuclei and the silver crystal nuclei.

JP5196301	Tribochemical reaction promotion surface structure
JPS63235087	BUILD-UP WELDING METHOD
WO/2003/020836	FLUOROPOLYMER DISPERSION CONTAINING NO OR LITTLE LOW MOLECULAR WEIGHT FLUORINATED SURFACTANT

JIU JINTING (JP)
UESHIMA MINORU (JP)
SUGANUMA KATSUAKI (JP)
LI WANLI (JP)

PCT/JP2018/027602

January 31, 2019

July 24, 2018

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SENJU METAL INDUSTRY CO (JP)
UNIV OSAKA (JP)

C23C26/00; C09D11/037; C09D11/52; H01B13/00; H05K3/12; C22C5/08; C22C9/00

WO2014156489A1	2014-10-02
WO2013073241A1	2013-05-23

JP2017074702A	2017-04-20
JP2017041504A	2017-02-23
JP2006183110A	2006-07-13
JP2015147929A	2015-08-20
JP2013196881A	2013-09-30

SEIZO NAGASAKIMAKOTO HIRABAYASHI: "Binary Alloy Phase Diagrams", 30 May 2013, AGNE GIJUTSU CENTER INC., pages: 4
See also references of EP 3660185A4

KENMOTSU Hidetaka (JP)

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