METHOD AND SYSTEM FOR MANUFACTURING METASURFACE

Title:

METHOD AND SYSTEM FOR MANUFACTURING METASURFACE

Document Type and Number:

WIPO Patent Application WO/2024/048104

Kind Code:

A1

Abstract:

Provided are a method and a system that are for manufacturing a metasurface, that can be easily adapted for substrates of various sizes, and that can realize reduction in manufacturing cost. This method for manufacturing a metasurface comprises: forming a conductive film on at least one of a first surface of a substrate and a second surface thereof opposite to the first surface (S10); sticking a dry film resist to the surface on which the conductive film has been formed (S12); irradiating, with drawing light, the dry film resist and drawing a pattern corresponding to a conductive periodic structure (S14, S18); executing development for the dry film resist on which the pattern has been drawn (S20); executing etching for the conductive film (S22); and removing the dry film resist (S24).

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Inventors:

KYOSO TADASHI (JP)
SAWANO MITSURU (JP)

Application Number:

PCT/JP2023/026355

Publication Date:

March 07, 2024

Filing Date:

July 19, 2023

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

H01Q15/14; G02B1/00; G02B3/00; G03F7/20; H01P11/00; H01Q15/02

Foreign References:

JP2021048465A	2021-03-25
JP2001144415A	2001-05-25
JP2018046395A	2018-03-22

Attorney, Agent or Firm:

MATSUURA Kenzo (JP)

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