METHOD TO USE LAMINATE GAP FILL TO REDUCE THERMAL CROSS TALK IN 3D X-POINT MEMORY ARRAY - YANGTZE ADVANCED MEMORY IND INNOVATION CENTER CO LTD

Title:

METHOD TO USE LAMINATE GAP FILL TO REDUCE THERMAL CROSS TALK IN 3D X-POINT MEMORY ARRAY

Document Type and Number:

WIPO Patent Application WO/2022/073221

Kind Code:

A1

Abstract:

Systems, methods, and apparatus are described which can reduce the amount of thermal crosstalk between cells in a three dimensional array of memory cells through the use of laminate materials which in turn allow for a smaller scale manufacture of memory cells.

Inventors:

LIU JUN (CN)

Application Number:

PCT/CN2020/120144

Publication Date:

April 14, 2022

Filing Date:

October 10, 2020

Export Citation:

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Assignee:

YANGTZE ADVANCED MEMORY IND INNOVATION CENTER CO LTD (CN)

International Classes:

G11C5/06; G11C7/04; G11C5/12

Foreign References:

CN107112345A	2017-08-29
CN101068024A	2007-11-07
CN103560205A	2014-02-05
US20180205017A1	2018-07-19

Attorney, Agent or Firm:

NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD. (CN)

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