Title:
METHOD FOR TWO-SIDED POLISHING OF WAFER
Document Type and Number:
WIPO Patent Application WO/2019/130764
Kind Code:
A1
Abstract:
Provided is a method for two-sided polishing of a wafer that makes it possible to curb variance between batches in GBIR values of polished wafers. This method for two-sided polishing of a wafer is characterized by comprising: a step (S100) for measuring a central thickness of an unpolished wafer in a current batch; a step (S110) for setting a target GBIR value from a predetermined range; a step (S120) for calculating a polishing duration for the current batch on the basis of formula (1); and a step (S130) for polishing both sides of the wafer for the calculated polishing duration. Formula (1): Polishing duration for current batch = polishing duration for prior batch + A1 × (central thickness of unpolished wafers for prior batch - central thickness of unpolished wafers for current batch) + A2 × (GBIR value for polished wafers of prior batch - target GBIR value) + A3. Where A1, A2, and A3 are predetermined coefficients.
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Inventors:
MIYAZAKI YUJI (JP)
Application Number:
PCT/JP2018/039362
Publication Date:
July 04, 2019
Filing Date:
October 23, 2018
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B37/08; B24B49/12
Domestic Patent References:
| WO2014002467A1 | 2014-01-03 | |||
| WO2013069198A1 | 2013-05-16 |
Foreign References:
| JP2011134823A | 2011-07-07 | |||
| JP2008227393A | 2008-09-25 | |||
| JP2015123545A | 2015-07-06 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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