Title:
METHOD FOR UTILIZING BENDING MACHINE DIE LAYOUT, AND ITS APPARATUS
Document Type and Number:
WIPO Patent Application WO/2008/004627
Kind Code:
A1
Abstract:
Provided is a method for utilizing a bending machine die layout. The method comprises
a step of designating the die layout of a bending machine, a step of extracting
an area, where a punch and a die confront each other, in the designated die layout
as a virtual die stage, and a step of allocating the extracted die stage with respect
to each bending line by using a plate form model of working parts.
Inventors:
SENBA AKIRA
Application Number:
PCT/JP2007/063479
Publication Date:
January 10, 2008
Filing Date:
July 05, 2007
Export Citation:
Assignee:
AMADA CO LTD (JP)
SENBA AKIRA
SENBA AKIRA
International Classes:
B21D5/02
Domestic Patent References:
| WO1998001243A1 | 1998-01-15 |
Foreign References:
| JPH0246920A | 1990-02-16 | |||
| JPS6336925A | 1988-02-17 | |||
| JP2004160547A | 2004-06-10 | |||
| JP2006187129A | 2006-07-13 |
Other References:
See also references of EP 2039442A4
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (2-8 Toranomon 1-chome,Minato-k, Tokyo 01, JP)
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